OIF released new details on its live interoperability demonstrations at OFC 2025, highlighting advancements across critical areas such as 800ZR, 400ZR, OpenZR+ and multi-span optics; Common Electrical I/O (CEI) CEI-112G, CEI-224G and CEI-448G; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI) and Co-Packaging.
The demonstrations showcased in Booth #5745 April 1-3 in San Francisco, USA, feature collaboration among 35 member companies and highlight the organization's leadership in interoperability across a range of cutting-edge technologies.
“As an organization, OIF is focused on driving innovation and collaboration to meet the demands of hyperscalers and other stakeholders in the rapidly evolving data center ecosystem,” said Mike Klempa, OIF Board and Physical & Link Layer Interoperability Working Group Chair (Alphawave Semi). “Our members’ commitment to advancing interoperability is paving the way for seamless scaling of AI networks and robust data center interconnects. Through collaborative innovation, OIF is enabling an interconnected future.”
Lessengers will be presenting its latest advanced technologies as a participating member company.
For more details, please visit OIF website.
https://www.oiforum.com/meetings-events/oif-ofc-2025/.
