
SEOUL, South Korea & St. Louis, MO —(Business Wire)— LESSENGERS Inc., a provider of innovative optical components based on its patented “direct optical wiring” (DOW) technology, will conduct an industry-first demonstration of an immersion-cooled detachable 800G NPO (near-packaged optics) module directly integrated with an AlphaCHIP1600-IO chiplet from Alphawave Semi at the SC25 event in booth 5308 at the America’s Center Convention Complex in St. Louis. Both the optics and chiplet are completely submerged in the cooling liquid.
The demonstration, running November 18th – 20th, will also show interoperability with Lessengers’ 800G optics operating in a commercially-available 800G Ethernet switch.
DOW is polymer-based air-cladded waveguide technology that replaces the use of lens optics in transceivers. It is a direct coupling method that creates a hermetically sealed environment and, as a result, protects the optics from cooling fluids. Therefore, the Lessengers 800G NPO eliminates the costs associated with the additional sealing, packaging or assembly required to make similar products suitable for immersion cooling.
In addition, NPO designs offer serviceability and open ecosystem benefits that offer deployment and other “time-to-market” advantages.
Other DOW features contributing to the energy efficiency, bandwidth and performance attributes of NPO (and CPO – co-packaged optics) include:
Lastly, the transition to 1.6T (Terabit) connectivity has begun and 3.2T optics are approaching commercial feasibility. Immersion cooling will be essential for these high-speed components, as their thermal capacity exceeds the limits of conventional air cooling, particularly in dense environments where a thermal crosstalk becomes a critical risk.
For more details, please visit BUSINESS WIRE website.
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The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC25) is the world’s leading event for the supercomputing industry. Held annually since 1988, SC brings together global experts from research, academia, and industry to showcase the latest breakthroughs in AI, HPC, cloud architecture, and advanced networking technologies. SC25 takes place in St. Louis, Missouri, from November 16–21, 2025, with the exhibition running November 18–20.