Direct Optical Wire (DOW)
The disruptive innovation of direct optical wiring (DOW) in integrated optical interconnects will fertilize the future.
Direct Optical Wire (DOW) Bonding Technology
- Cutting-edge metal wire bonding-like optical wire
- Simple open-to-air polymerization of a polymer solution
- Nanoscale ultra-thin diameter, as thin as 0.2 μm
- Robust and reliable thermo-mechanical properties
- -High-temperature/high-humidity resistance up to 250°C
- -Low-temperature resistance of – 70°C
Direct Optical Wire (DOW)
The disruptive innovation of direct optical wiring (DOW) in integrated optical interconnects will fertilize the future.
Direct Optical Wire (DOW) Bonding Technology
- Cutting-edge metal wire bonding-like optical wire
- Simple open-to-air polymerization of a polymer solution
- Nanoscale ultra-thin diameter, as thin as 0.2 μm
- Robust and reliable thermo-mechanical properties
- -High-temperature/high-humidity resistance up to 250°C
- -Low-temperature resistance of – 70°C
Datacenter Optical Interconnects
Key Features of Direct Optical Wired (DOW) Optical Interconnects
No active alignment
Cost-competitive optical coupling
Free from lens assembly
Nearly zero optical crosstalk
No
air gap
Very low reflection noise compared to the others
High freedom ofheat sink design
Advantages in thermal management
Lessengers-patented technology
20 patents granted/pending worldwide
Highly-Integrated Low Power Consumption Optical Engines
400G QSFP112 SR4 Optical Transceiver
800G QSFP112-DD SR8 Optical Transceiver
